| PART |
Description |
Maker |
| 21-0076 |
PACKAGE OUTLINE, 5L SC70
|
Maxim Integrated Products
|
| FDG6322C |
Very small package outline SC70-6.
|
TY Semiconductor Co., L...
|
| 21-0076B |
PACKAGE OUTLINE, SC70, 5L
From old datasheet system
|
MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
|
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
| WDFN3X3-10 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
| DFN1.6X1.6-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-24 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3X6-32 |
Package Outline
|
Global Mixed-mode Techn...
|
